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1 direct step-on-wafer
пряме послідовне крокове експонування (без застосування шаблонів)English-Ukrainian dictionary of microelectronics > direct step-on-wafer
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2 direct step-on-wafer system
устаткування прямої проекційної літографії з послідовним кроковим експонуваннямEnglish-Ukrainian dictionary of microelectronics > direct step-on-wafer system
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3 direct step-onto-wafer aligner
установка прямого послідовного крокового експонування (без застосування шаблонів)English-Ukrainian dictionary of microelectronics > direct step-onto-wafer aligner
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4 step-on-wafer
послідовне крокове експонуванняEnglish-Ukrainian dictionary of microelectronics > step-on-wafer
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5 system
1) система 2) устаткування; пристрій - assembly system
- autolayout system
- automated accounting system
- automated photomasking system
- automated photomask system
- automatic data асquisition system
- automatic data analysis system
- automatic data digitizing system
- base-metal system
- batch system
- bi-etching system
- bubble test system
- building-block layout system
- CAD system
- cassette-to-cassette system
- chopping system
- closed-tube oxidation-diffusion system
- code-translation data system
- command retrieval system
- computer-aided design system
- conductor paste system
- conductor system
- continuous stage motion e-beam system
- Czochralski production system
- damage tolerant system
- data асquisition and display system
- data analysis and reduction system
- data collection and processing system
- decision data support system
- decision-support system
- deep-UV projection system
- design automation system
- die attach system
- dielectric paste system
- dielectric system
- diffusion system
- direct step-on-wafer system
- direct-write e-beam system
- dopant system
- double-chamber vacuum-deposition system
- double-track system
- electron-beam mask system
- electron-beam projection system
- encapsulation welding system
- epitaxial growth system
- epitaxial system
- epoxy dispensing system
- etchant regeneration system
- etching system
- etch/strip system
- evaporation system
- exposure system
- fabrication system
- fault-tolerant system
- flex-fab system
- flexible machining system
- fly’s eye system
- gate-array layout system
- Gaussian-beam e-beam system
- Genesil system
- graphite furnace atomic absorption system
- hierarchically CAD system
- hierarchical-oriented CAD system
- high-resolution electron-beam system
- IC system
- image projection system
- indexing system
- ink system
- in-line system
- integrated programmable gate-array system
- ion-beam system
- ion-beam sputtering system
- isoplanar system
- laminar-flow system
- lead-forming system
- lead-frame assembly system
- lithographic system
- lithography system
- logic analysis system
- logic synthesis system
- mask alignment and exposure system
- metal system
- metallization system
- Micralign system
- micro-Optical Electro-Mechanical systems MOEMS
- micro-Optical Electro-Mechanical systems
- micropower system
- multichip system
- multicircuit microprocessor system
- multidomain system
- multiple-tens camera system
- negative-resist system
- non-real-time data automation system
- one-step t-fault diagnosable system
- one-to-one scanning system
- on-line circuit analysis system
- on-line circuit design system
- open-ended CAD system
- open-tube system
- palladium-silver thick-film conductor system
- palladium-silver conductor system
- paste system
- photomasking system
- photorepeating system
- pick-and-place system
- planar plasma system
- plenum flush system
- portable CAD system
- positive resist system
- preinsertion processing system
- printed-circuit board assembly system
- printed-circuit assembly system
- probing system
- processing system
- production system
- projection printing system
- projection system
- quick vacuum system
- reduced system
- reducing electron -beam projection system
- reducing electron projection system
- reflow soldering system
- rinser/dryer system
- screen printing system
- scribing system
- self-documenting CAD system
- self-repair system
- sequentially t-fault diagnosable system
- shaped-beam e-beam system
- single-chip system
- SMIF system
- software test-bed system
- solder evacuation system
- solder fusion system
- split-chamber vacuum coating system
- split-field alignment system
- step-and-repeat system
- step-and-repeat photomask system
- step-on-wafer projection system
- surface measurement system
- terminal point detection system
- thermal mapping system
- thick-film resistor system
- transfer system
- transport system
- tri-metal system
- trimming system
- turnkey CAD system
- UV exposure system
- vacuum-deposition system
- vacuum purge system
- variable-shaped electron-beam exposure system
- vector-scan e-beam system
- wafer gaging system
- wafer routing system
- wafer-scale system
- wafer-stepper projection system
- wave solder system
- wiring system
- X-ray exposure system -
6 aligner
установка суміщення (і експонування); установка літографії- automaskaligner- autoaligner
- contact aligner
- deep-UV projection aligner
- diffusion tube aligner
- direct step-onto-wafer aligner
- electron-beam aligner
- full-field mask aligner
- full-field aligner
- hard-contact aligner
- mask aligner
- projection aligner
- proximity aligner
- reduction projection aligner
- site aligner
- soft-contact aligner
- step-and-repeat aligner
- step-by-step aligner
- stepper aligner
- shadow projection mask aligner
- shadow mask aligner
- submicron mask aligner
- submicron aligner
- wafer aligner
- wafer-stepping aligner
- X-ray aligner -
7 lithography
(мікро) літографія. Процес перенесення малюнка на поверхню пластини за допомогою світлового випромінювання (photolithography), потоку електронів або рентгенівського випромінювання (X-ray lithography) - charged-particle lithography
- contact lithography
- contactless lithography
- contrast-enhanced lithography
- deep-UV lithography
- direct growth lithography
- direct-write electron-beam lithography
- dot lithography
- dual-surface lithography
- electron-beam lithography
- electron lithography
- excimer laser lithography
- fine-line lithography
- focused ion-beam lithography
- full-wafer lithography
- bard-contact lithography
- high-resolution lithography
- high-voltage EB lithography
- holographic lithography
- hybrid lithography
- i-line lithography
- ion-beam lithography
- laser-basedlithography
- laserlithography
- lift-off lithography
- mask lithography
- maskless lithography
- micrometer micron lithography
- micron lithography
- molecular-level lithography
- optical lithography
- positive-resist projection lithography
- precise registration lithography
- projection lithography
- proximity lithography
- raster-scan electron-beam lithography
- resistless lithography
- scaled-down lithography
- scanning electron-beam lithography
- scanning ion-beam lithography
- self-aligned dual-surface lithography
- soft lithography
- soft-contact lithography
- step-and-repeat lithography
- step-on-wafer lithography
- stepper lithography
- submicron lithography
- synchrotron-radiationlithography
- synchrotronlithography
- ultraviolet lithography
- vector-scan electron-beam lithography
- wafer lithography
- wafer-stepper lithography
- write e-beam lithography
- X-ray lithographyEnglish-Ukrainian dictionary of microelectronics > lithography
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8 equipment
устаткування; апаратура - assembly equipment
- automated test equipment
- automatic drafting equipment
- beam-tape microinterconnection equipment
- capital equipment
- chip production equipment
- computer-aided equipment
- computer update equipment
- cryogenic equipment
- diffusion equipment
- direct-wafer-stepping equipment
- evacuation equipment
- fabrication equipment
- high-vacuum technology equipment
- in-line equipment
- inspection equipment
- interactive graphics equipment
- interconnection equipment
- leased-circuit connection equipment
- manufacturing equipment
- masking equipment
- mask-making equipment
- microinterconnection equipment
- photolithography equipment
- plotting equipment
- polysilicon diffusion equipment
- printing equipment
- processing equipment
- production equipment
- projection alignment equipment
- step-and-repeat equipment
- step-on-wafer equipment
- support equipment
- tape-carrier system equipment
- wafer handling equipment
- wafer-measuring equipment
- wafer-processing equipment
- wafer-stepping equipment
- yellow room equipmentEnglish-Ukrainian dictionary of microelectronics > equipment
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9 exposure
1) експонування 2) розкриття, оголення (напр. шару під маскою) - contact exposure
- deep-UV exposure
- die-by-die pattern exposure
- direct wafer exposure
- direct-writing exposure
- electron-beam exposure
- flood exposure
- full-field [full-wafer] exposure
- ion exposure
- laser exposure
- light optical exposure
- light exposure
- mask exposure
- multiple exposure
- pattern exposure
- postdevclopment exposure
- projection exposure
- proton exposure
- proximity exposure
- SOR exposure
- step-and-repeat exposure
- synchrotron exposure
- ultraviolet exposure
- X-ray exposure -
10 process
1. ім.1) процес; (технологічний) метод, спосіб2) технологія (див. т-ж technique, technology)3) (технологічна) обробка; технологічна операція2. дієсл. обробляти; проводити технологічну операцію - all-ion-implant process
- all-planar process
- Auger process
- batch process
- BH bias and hardness process
- BH process
- bonding process
- BOX process
- bulk CMOS process
- bumping process
- chip-on-board process
- closed CMOS process
- CMOS-on-sapphire process
- composite сеll logic process
- contact process
- conventional process
- deep охide isolation process
- DIFET process
- diffused eutectic aluminum process
- direct synthesis and crystal pull process
- double-diffused process
- double ion-implanted process
- double-layer polysilicon gate MOS process
- double-layer polysilicon gate process
- epitaxial deposition process
- epitaxial process
- epitaxial growth process
- flip-over process
- floating-gate silicon process
- front-end process
- gold-doped process
- guard-banded CMOS process
- heterogeneous process
- high-voltage process
- HMOS process
- imaging process
- implantation process
- in-house process
- interconnection process
- inverted meniscus process
- ion plating process
- isoplanar -S, -Z, -2 process
- isoplanar process
- junction-isolated process
- laser-recrystallized process
- lithographic process
- low-pressure process
- low VT process
- lost wafer process
- major process
- masking process
- master slice process
- mesa-isolation process
- metal-gate MOS process
- metal-gate process
- microbipolar LSI process
- micrometer-dimension process
- mid-film process
- Minimod process
- Mo-gate MOS process
- Mo-gate process
- nitride process
- nitrideless process
- NSA process
- oxide-film isolation process
- oxide isolated process
- oxygen refilling process
- patterning process
- phosphorous buried-emitter process
- photoablative process
- photolithography process
- photoresist process
- planar oxidation process
- Planox process
- plasma etch process
- Poly I process
- Poly II process
- Poly 5 process
- poly-oxide process
- Poly-Si process
- polysilicon-gate process
- poly-squared MOS process
- proprietary process
- PSA bipolar process
- PSA process
- refractory metal MOS process
- refractory metal process
- sacrificial охide process
- sapphire dielectric isolation process
- scaled Poly 5 process
- screen-and-fire process
- selective field-охidation process
- self-aligned gate process
- self-aligned process
- self-registered gate process
- self-registered process
- semi-additive process
- semiconductor-thermoplastic-dielectric process
- semicustom process
- shadow masking process
- silk-screen process
- single poly process
- SMOS process
- SOS/CMOS process
- stacked fuse bipolar process
- Stalicide process
- step-and-repeat process
- subtractive-fabrication process
- surface process
- Telemos process
- thermal process
- thermally асtivated surface process
- thermal-охidation process
- three-mask process
- triple-diffused process
- triply-poly process
- twin-tub process
- twin-well process
- V-groove MOS process
- V-groove process
- wet process
- 3-D process
См. также в других словарях:
direct step-on-wafer exposure — tiesioginis žingsninis plokštelės eksponavimas statusas T sritis radioelektronika atitikmenys: angl. direct step on wafer exposure vok. direkte Waferbelichtung im Step and Repeat Verfahren, f rus. прямое последовательное шаговое экспонирование на … Radioelektronikos terminų žodynas
direkte Waferbelichtung im Step-and-Repeat-Verfahren — tiesioginis žingsninis plokštelės eksponavimas statusas T sritis radioelektronika atitikmenys: angl. direct step on wafer exposure vok. direkte Waferbelichtung im Step and Repeat Verfahren, f rus. прямое последовательное шаговое экспонирование на … Radioelektronikos terminų žodynas
exposition successive directe — tiesioginis žingsninis plokštelės eksponavimas statusas T sritis radioelektronika atitikmenys: angl. direct step on wafer exposure vok. direkte Waferbelichtung im Step and Repeat Verfahren, f rus. прямое последовательное шаговое экспонирование на … Radioelektronikos terminų žodynas
tiesioginis žingsninis plokštelės eksponavimas — statusas T sritis radioelektronika atitikmenys: angl. direct step on wafer exposure vok. direkte Waferbelichtung im Step and Repeat Verfahren, f rus. прямое последовательное шаговое экспонирование на пластине, n pranc. exposition successive… … Radioelektronikos terminų žodynas
прямое последовательное шаговое экспонирование на пластине — tiesioginis žingsninis plokštelės eksponavimas statusas T sritis radioelektronika atitikmenys: angl. direct step on wafer exposure vok. direkte Waferbelichtung im Step and Repeat Verfahren, f rus. прямое последовательное шаговое экспонирование на … Radioelektronikos terminų žodynas
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